Products /
Overmolds
Engineered to
Endure
ISC’s overmolding capabilities build protection directly into the assembly. With in-house molding expertise and U.S.-based manufacturing, we strengthen vulnerable areas where exposure, movement, weight, and repeatability affect performance. We align material, tooling, and process decisions so protection becomes part of how the product is built.
Thermoplastic Overmolds
Thermoplastic overmolding gives assemblies a durable finished form while adding protection at the areas most exposed to wear, handling, and environmental stress. ISC uses this process to strengthen key transition points and create a cleaner, more consistent production approach.
For the right application, thermoplastic overmolding can replace heavier or more time-intensive protection methods with a molded solution built into the assembly.
Low Pressure Overmolds
Low-pressure molding allows ISC to encapsulate sensitive assemblies with a more controlled process than traditional injection molding. It is especially valuable for components that require protection without the force, heat, or variation of more aggressive methods.
For the right build, low-pressure molding can replace slower manual processes with a cleaner, faster, and more repeatable approach to protection.
Protect Lives – Enable Missions – Advance Innovation
Encapsulated Printed Circuit Boards
Encapsulated PCBs require careful process control because the board and components must be protected without being compromised. ISC uses low-pressure molding to help shield sensitive electronics while preserving the function and integrity of the assembly.
This capability supports products where exposure, handling, or operating conditions can put added stress on the electronics inside.
Molded Strain Relief
Molded strain relief strengthens the areas where cables and connectors experience movement, bending, or repeated handling. By building protection into the assembly, ISC helps reduce stress at the points where wear often begins.
This added support can improve durability, extend product life, and create a cleaner transition between cable and connector.
